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主题：求AES文献-SPICE Simulation of Headphones and Earphones
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等级：业余侠客 帖子：69 积分：699 威望：0 精华：0 注册：2011-11-28 19:04:22 		求AES文献-SPICE Simulation of Headphones and Earphones  发帖心情 Post By：2013-4-15 18:01:30 [只看该作者]

有没有AES的会员呀，帮忙下载下来吧，谢谢了～

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SPICE Simulation of Headphones and Earphones

Unlike loudspeakers, headphones and earphones are not in the mainstream of electroacoustical design. In this paper, different designs for headphones and earphones are discussed and simulated with the aid of SPICE, the well known electrical circuit simulator. These simulations can be used to perform elementary design tradeoffs. One significant difficulty is the lack of component measurements in the open literature. The paper begins with an overview of design aspects of headphones. This is followed by a review of the use of SPICE as an electroacoustical simulator. The following section detai ls various experiments done using SPICE to explore headphone design. The conclusion decries the lack of publicly available information as well as the dearth of components.

Author: Kahrs, Mark
Affiliation: University of Edinburgh, Edinburgh, UK
AES Convention:127 (October 2009) Paper Number:7843 Import into BibTeX
Subject:Transducer Modeling and Design

E-Library Location: (CD 127Papers)   /127/7843.pdf

 

链接：

http://www.aes.org/e-lib/browse.cfm?elib=15038

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等级：新手上路 帖子：376 积分：2315 威望：0 精华：0 注册：2011-3-1 21:33:04 		  发帖心情 Post By：2013-4-16 9:15:58 [只看该作者]

 虽然不太地道...但是...其实我也想要...图片点击可在新窗口打开查看


谁等谁等了一万年，只是等来了一个错；谁对谁凝望一秒钟，转瞬带走了传说...
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很好，我也需要：eric.zhao2@sz-sunway.com,非常感谢！
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After checked, It's here needs 5 USD lala... if download.

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Acoustics
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等级：版主 帖子：3520 积分：26241 威望：2 精华：19 注册：2006-2-13 13:44:44 		  发帖心情 Post By：2013-4-28 17:28:18 [只看该作者]

Poldy’s AKG headphone
.INCLUDE IEC711.cir
* sorta includes air gap impedances
* electrical model (from 45 mm driver)
VAeg 1 0 AC 1V DC 0V
Rew 1 2 124
Lew 2 3 900u
HBLU 3 4 VA2 4.50
VA1 4 0 AC 0V DC 0V
* mechanical model
HBLI 5 0 VA1 4.50
Lm 5 6 314u
Rm 6 7 13m
Cm 7 8 2.4e-3
ESDP 8 9 50 10 8.8e-4
VA2 0 9 AC 0V DC 0V
* acoustical model (in the middle)
FSDU 10 50 VA2 8.8e-4
VA3 0 30 AC 0V DC 0V
* acoustical model backward from membrane
** cavities behind passive membranes
C123 10 30 0.97u
** ports from C1 (RLs in parallel)
RB 10 11 5
LB 11 15 31m
R3 10 12 30
L3 12 15 2.9m
** back cavity -- same as front
CB 15 30 25u
** radiation impedance from the rear (1 cm)
Lrear 15 30 31.88
Crear 15 16 4.2787e-11
Rrear1 15 16 56.8168e+5
Rrear2 16 30 128.8327e+6
* acoustical model forward (to ear)
VA4 0 40 AC 0V DC 0V
** ear diaphragm cavity
C0 50 40 25u
** cushion
Rbb 50 51 6
Lbb 51 52 0.6m
Cbb 52 40 210u
** leak
R0 50 55 3
L0 55 56 3.0m
** radiation impedance
Lleak 56 40 31.88
Cleak 56 57 4.2787e-11
Rleak1 56 57 56.8168e+5
Rleak2 57 40 128.8327e+6
** passive membrane
Rpm 50 58 3.3
Lpm 58 59 0.3m
Cpm 59 40 530u
*
X1 50 60 40 IEC711
*Vindrum 50 40 AC 0V DC 0V
Voutdrum 60 40 AC 0V DC 0V
.AC DEC 20 10 10K
.print ac i(Voutdrum)
.END


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Acoustics
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* IEC711_Coupler (from B&K)
* 1 input
* 2 output
* 3 return (ground)
.SUBCKT IEC711 1 2 3
La4 1 51 82.9
Ca4 51 3 0.943e-12
Ra5 51 52 50.6e6
La5 52 53 9.4e3
Ca5 53 3 1.9e-12
La6 51 54 130.3
Ca6 54 3 1.479e-12
Ra7 54 55 31.1e6
La7 55 56 983.8
Ca7 56 3 2.1e-12
La8 54 2 133.4
Ca8 2 3 1.517e-12
.ENDS IEC711


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Acoustics
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等级：版主 帖子：3520 积分：26241 威望：2 精华：19 注册：2006-2-13 13:44:44 		  发帖心情 Post By：2013-4-28 17:31:43 [只看该作者]

REFERENCES
[1] C. Poldy, “Headphones,” in Loudspeaker and
Headphone Handbook, John Borwick, Ed., pp.
585–692. Focal Press, 2001.
[2] J. Borwick, Ed., Loudspeaker and headphone
handbook, 3rd ed., Focal Press, 2001.
[3] C. Poldy, “Headphone fundamentals,” in Conference
Record, AES 120th Convention, Paris,
France, June 21 2006.
[4] H. F. Olson, Dynamical Analogies, 2nd Ed.,
Van Nostrand, Princeton, N.J, 1958.
[5] Leo L. Beranek, Acoustics (revised Ed.), Amer
Inst of Physics, Dec. 1986.
[6] B. N. Locanthi, “Application of electric circuit
analogies to loudspeaker design problems,”
IRE Trans. Audio, vol. PGA-6, Mar. 1952,
Reprinted in J. Audio Eng. Soc. 9, 778-785 Nov.
1971.
[7] A. N. Thiele, “Loudspeakers in vented boxes,
parts and,” J. Audio Eng. Soc., vol. 19, pp.
382–392, May 1971, Also pp. 471-483 (June
1971).
[8] R. H. Small, “Direct-radiator loudspeaker system
analysis,” J. Audio Eng. Soc., vol. 20, pp.
383–395, June 1972.
[9] L. W. Nagel and D. O. Pederson, “(simulation
program with integrated circuit emphasis),”
Memorandum No. ERL-M382, University
of California, Berkeley, Apr. 1973.


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Acoustics
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等级：版主 帖子：3520 积分：26241 威望：2 精华：19 注册：2006-2-13 13:44:44 		  发帖心情 Post By：2013-4-28 17:32:37 [只看该作者]

[10] W. M. Leach, “Computer-aided electroacoustic
design with,” Journal of the Audio Engineering
Society, vol. 39, no. 7/8, pp. 551–563, July 1991.
[11] ITU, “Artificial ears,” P.57, ITU, Aug. 1996.
[12] S¨oren J¨onsson, Bin Liu, Lars B. Nielsen, and
Andreas Schuhmacher, “Simulation of couplers,”
in 114th Convention, Workshop 7, Amsterdam,
The Netherlands, March 23 2003, AES.
[13] E. A. G. Shaw and G. J. Theissen, “Acoustics
of circumaural earphones,” JASA, vol. 34, no.
9, pp. 1233–1246, Sept. 1962.
[14] K. Ohta, F. Matsuda, T. Tanaka, K. Ohnuki,
N. Miyaji, and H. Sato, “Open-back type headphone
with a detachable attachment,” U.S.
Patent 4041256, Granted Aug. 1977, Filed on
Apr. 30, 1976.
[15] R. Gorike, “Headphone,” U.S. Patent 4005278,
Granted Jan. 25 1977, Filed Sept. 15, 1975.
[16] R. Sapiejewski, “Supra aural active noise reduction
headphones,” U. S. Patent 6567525,
Granted May 20 2003, Filed June 17, 1994.
[17] G. R. Ruben and F. E. Heinrich, “Electroacoustic
transducers,” U. S. Patent 3013905, Granted
Dec. 1961, Filed Nov. 20, 1958.
[18] T. Asahi, “Dynamic electroacoustic transducer,”
U. S. Patent 3898598, Granted Aug.
5 1975, Filed Oct. 30, 1974.
[19] Y. Yokoyama, S. Watanabe, and K. Nageno,
“Ear piece transducer,” U.S. Patent 4736435,
Granted Apr. 5 1988, Filed August 3, 1985.
[20] M. Tikander, “Modeling the attenuation of a
loosely-fit insert headphone for augmented reality
audio,” in Proceedings of the 30th AES
Conference, Saariselk¨a, March 15-17 2007.
[21] P. N. Bakalos, R. Sapiejewski, and J. M.
Harlow, “Passive headphone equalizing,”
U.S. Patent Application 20080152162, Granted
2008, Filed June 2008.
[22] R. Sapiejewski, K. P. Annunziato, I. M. Collier,
W. W. Tice, and J. M. Harlow, “Earphones,”
U.S. Patent Application 20080002835, Granted
2008, Filed June 2008.


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